Abstract

At IMAPS2021, we reported on 1-dimensional VCSEL arrays and the packaging technology developed for these arrays, but this time we present the manufacturing workflow and look at the challenges presented by the packaging of special long-wavelength 2-dimensional vertical-cavity surface-emitting laser (VCSEL) arrays in various dimensions. We will show that available packaging technologies for epoxy application by silk screening, die- and wire bonding can be adapted for the unique properties of the 2D VCSEL arrays, delivering high accuracy for production with great overall yield. Proof of the excellent reliability and lifetime will be given through mechanical and electro-optical testing results. The technologies developed for 2D laser arrays will enable new devices for various new applications like high channel count interconnects for data communication and high power VCSEL solutions for 3D sensing. The perfected wire bonding process secured a homogeneous monometallic structure of the wire bonds, a reduced, well defined bond loop height, with sufficient clearance of the bonding wire above the VCSEL surface. Properly set-up manufacturing procedures for the packaging of the VCSEL arrays are necessary to achieve high performance and reliability of the products presented. Processing of large 2D-VCSEL arrays will be part of the paper. 2D arrays have enabled VCSEL technologies to address a wide range of new laser-based sensing applications. VCSEL products vary from laser chips with only a few emitters for proximity sensors up to several thousands of emitters for LiDAR systems. Applications include systems for the automotive, industrial, medical and consumer markets. There is a strong and growing market opportunity for long wavelengths VCSELs, e.g. based on InP material enabling single mode and multi-mode 2D-VCSEL arrays from 1.3 to beyond 2 µm. For 3D sensing systems and free-space optical communication, long wavelength 2D-VCSEL arrays offer improved eye safety and further benefits. The long wavelength VCSELs discussed in this paper can be deployed in a wide range of sensing and optical communication applications.

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