Negative bias-temperature instabilities in metal–oxide–silicon devices with SiO2 and SiOxNy/HfO2 gate dielectrics

Abstract

Negative bias-temperature instability (NBTI) in metal–oxide–semiconductor capacitors with SiOxNy/HfO2 gate dielectrics is compared to those with thermal SiO2 oxides. Activation energies for interface and oxide-trap charge densities for each device type, estimated from capacitance–voltage measurements versus temperature and electric field, lie in the range 0.2–0.4 eV. This suggests that the release of hydrogen from, e.g., oxide protrusions in Si, followed by the lateral motion of protons along the interface (activation energy ∼0.3 eV), may play a key role in NBTI. Passivation reactions between protons and Si–H can create interface traps, and proton capture by sub-oxide bonds (O vacancies) can lead to positive trapped-oxide charge.