Abstract
Wire bonding is the most common technology to connect bare dies on hybrids. For such applications, e.g. automotive applications or sensor modules, highly reliable Au/Au interconnections are preferred. But the standard ball/wedge bond process for Au-wires requires temperatures over 120degC, which is a serious disadvantage when connecting temperature sensitive devices. One of the most promising solution to overcome this problem is alumina coated Au bonding wires. In the present work we have studied the characterisation and optimisation of coated gold wires for ultrasonic wedge/wedge bonding, including the optimisation of wire bond process parameters, reliability testing and material characterisation of the metallurgical state of the wire bonds
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
