Abstract

This chapter discusses the effects of high humidity and high temperature, as well as high current densities, on the reliability of Cu wire bonds. Reliability data are provided from humidity reliability tests, pressure cooker tests, and highly accelerated stress tests on Cu wire-bonded parts. Comparisons are made between the humidity-related reliability of Cu and PdCu wire bonds. Electromigration tests to evaluate the reliability of wire bonds under high electrical current are also presented.

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