Abstract
Nanoparticles were prepared with a consumable-electrode direct current arc (CDCA) technique. The results showed that the calorimetric melting onset temperature of the nanoparticles of SnAgCu solder alloy could be as low as 179 °C, equivalent to that of the traditionally used SnPb eutectic alloy (183 °C). Moreover, the homogenous melting model (HMM) and Gibbs–Thomson equation were employed to theoretically estimate the size-dependent melting temperature of the as-prepared nanoparticles. The structure and morphology of the nanoparticles were analyzed with a high-resolution transmission electron microscopy (HRTEM). The CDCA technique showed promising prospect in manufacturing large amounts of nanoparticles with controlled shape, small size, narrow particle size distribution and nearly oxide-free composition. This undoubtedly puts forward a novel feasible approach to manufacture high quality lead-free solders for electronic products.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call