Abstract
This paper is aimed to review and study the interfacial reaction between SnAgCu (SAC) lead-free solder alloys and common copper substrates. Among the lead-free solders, a ternary solder alloys, SnAgCu (SAC) based solder, is leading the lead-free solders as it has excellent thermal and electrical properties. The interfacial between solder alloy and substrate comprise an important characteristic in the reliability performance of a solder alloy. As the current industry has driven to miniaturization, high integration and multifunctionality, the reliability and durability of solder joints are gained attention for its long-term performance of electronic products. Therefore, in this short review, the interfacial reaction between SAC solder alloys and copper substrate will be focused. Besides, the effects of the addition of microalloying elements into SAC solder alloys will be discussed.
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