Abstract
In recent years, PCI Express and USB have become established as high-speed serial transmission methods, reaching speeds of 5–10 Gbps and showing remarkable progress. As a result, several new design techniques for high-speed digital circuits have been recommended for printed circuit boards (PCB) by device makers. However, in order to adopt the actual designs, it is necessary to grasp their e ects and detailed mechanisms. We focused on a technology which removes the copper on the ground plane beneath the chip component pad, and veri ed the e ect. Design methods corresponding to the layer constitution and the material of the printed circuit board are proposed. e S-parameter, current distribution, and emission characteristics are analyzed by means of an electromagnetic eld analysis simulator (Sonnet EM) of the method-of-moment. In addition, the S-parameter of the test board was measured and the e ect was veri ed.
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