Abstract
The ultra clean sputtering process (UC-process) was introduced in the fabrication of thin film media and spin valve type Ni-Fe/25 at% Ni-Mn/Ni-Fe tri-layered films. As a result, the UC process enables the control of the fine structure of the thin films and resulted in excellent magnetic properties. This study demonstrates that the UC-process is superior to the normal process presently used and plays an important role for the thin film media and spin valve head fabrication.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
