Abstract
The ultra clean sputtering process (UC-process) was newly introduced in the fabrication of CoNiCr and CoCrTa thin film media to establish the new concept of controlling the microstructure and magnetic properties. The relation between cleanness during film deposition process and magnetic properties has been discussed in connection with their microstructure. The UC-process presented enables the control of the fine structure of the thin film media and resulted in excellent magnetic properties. This study demonstrates that the UC-process is very superior to the normal process presently used and plays a dominant role for the thin film media fabrication.
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