Abstract
After a brief review of the state of the art, this focus issue on multilayer millimeter-wave (mmW) multichip modules (MCMs) presents four cover features that showcase the evolution in some key areas of multilayer mmW MCM integration and packaging technologies: advanced interconnects, integration techniques, components, and systems that use additive as well as substructure manufacturing technologies aimed toward making next-generation mmW applications feasible. The first two features provide an overview of state-of-the-art multilayer ceramic-based multichip module and packaging techniques, while the third and fourth features are more specific: one describing SiP eWLB packaging techniques and the other covering recent developments in inkjet and 3-D printed components and subsystems using additive manufacturing technologies.
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