Abstract
The author describes the thermal characterization of an alumina-tungsten multilayer multichip module (MCM). A five-chip cavity-down MCM was designed to represent a typical substrate product. Thermal test multichip modules were assembled and the thermal performance quantified for both the internal and the external thermal resistances. The die junction-to-ambient resistance was measured in forced-air convection for the range of 1 to 5 m/s, for: (1) two pin-fin heat sinks, (2) a thermoelectric cooler with a pin-fin heat sink, and (3) a heat pipe with an integral extended surface. In addition, the run-to-run and the part-to-part variations, are presented. A discussion on the thermal management concepts and the heat transfer applicable to the MCM technology is included. >
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