Abstract

AbstractSilicide ceramics are attracted significant attention due to their exceptional physical properties. However, their inherent brittleness at room temperature limits their practical applications. Here, we aim to improve the mechanical properties of tantalum disilicide (TaSi2) ceramics by modifying the preparation methods and sintering conditions. We fabricate the dense TaSi2 ceramics using high‐pressure and high‐temperature (HPHT) sintering technology at 5.5 GPa and 800–1300°C. We characterize the microstructures, mechanical, and electronic properties of bulk TaSi2 ceramics at HPHT conditions. Our results indicate an enhancement in the fracture toughness of 11.97 MPa m1/2 for TaSi2 ceramics. More importantly, the electrical conductivity (47.13 × 105 S/m) of TaSi2 ceramic is increased and verified by theoretical calculations. These findings provide crucial insights for future applications of TaSi2 and offer valuable avenues for the design and synthesis of advanced ceramic materials.

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