Abstract
AbstractThe curing behavior of epoxy resins prepared by reacting epichlorohydrin with 4,4′‐diaminodiphenyl methane (DADPM)/4,4′‐diaminodiphenyl ether (DADPE) or 4,4′‐diaminodiphenyl sulfone (DDS) was investigated using DDS and tris‐(m‐aminophenyl)phosphine oxide (TAP) as curing agents. A broad exothermic transition with two maxima were observed in the temperature range of 100–315°C when TAP was used as the curing agent. The effect of varying DDS concentration on curing behavior of epoxy resin was also investigated. Peak exotherm temperature (Texo) decreased with increasing concentration of DDS, whereas heat of curing (ΔH) increased with an increase in amine concentration up to an optimum value and then decreased. Thermal stability of the resins, cured isothermally at 200°C for 3 h, was investigated using thermogravimetric analysis in a nitrogen atmosphere. Glass fiber‐reinforced multifunctional epoxy resin laminates were fabricated and the mechanical properties were evaluated. © 1993 John Wiley & Sons, Inc.
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