Abstract
This paper describes a new transfer method to realize wearable devices with embedded capacitors providing high permittivities and thinner structures. To miniaturize passive elements, such as capacitor on flexible substrate[1], lead zirconate titanate (PZT) thin films are formed on a Si substrate by MOD (metal organic decomposition) method, then can be easily transferred into a polymer (polydimethylsiloxane, PDMS or polyimide) without any chemical contamination. The thin film capacitor is composed of sandwich structure of PZT between two metal electrodes. To embed the capacitor layers in the polymer substrate, three kinds of self-assembled monolayers (SAMs) are investigated for adhesion or anti-adhesion layer among metal, polymer and Si substrate, respectively. As modifying the MOD's sintering process for PZT layers, thin capacitor in 1-μm-thick with perovskite structure is successfully transferred and embedded in a PDMS substrate.
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Schedule a callMore From: Proceedings of JSME-IIP/ASME-ISPS Joint Conference on Micromechatronics for Information and Precision Equipment : IIP/ISPS joint MIPE
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