Abstract
SUMMARYThis paper describes the fabrication method that a lead zirconate titanate (PZT) thin film capacitor, which is formed on a Si substrate by metal organic decomposition (MOD), can be easily transferred to flexible polymer (polydimenthylsiloxane; PDMS) without additional chemical contamination. The thin film capacitor is composed of sandwich structure of PZT between two metal layers. To embed the capacitor structure in the polymer substrate by dry peel‐off process, three kinds of self‐assembled monolayers (SAMs) were investigated for adhesion or antiadhesion layer between metal, polymer, and Si substrate, respectively. Also, the MOD's annealing process with SAMs for PZT lamination was investigated. As a result, the PZT capacitors of 1 μm thickness with a perovskite structure were successfully transferred and embedded in PDMS substrate. These results will be useful for fabricating MEMS devices and integration technology of electrical device to a polymer substrate such as capacitors in three‐dimensional integration or for flexible electronics.
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