Abstract
lnterconnection components like connectors, pins, and printed wiring board fingers are usually required to satisfy manufacturers and/or users specifications prior to being used. This entails monitoring such components for quality and, if necessary, controlling or resolving problems that arise. The following examples of such situations are discussed: 1) incoming material inspection procedures for monitoring quality of precious metal inlays used as contact finish, involving contact resistance measurements; 2) pass-fail requirement testing and demerit rating of discolored pins with electroplated gold finishes; 3) cleaning procedure for excessive lubricant in contact area; 4) controlling for uniformity in coverage of lubricant on contact areas; 5) resolving resistance failure of pins from solder reflow contamination with proper cleaning and production procedures; and 6) resolving resistance failure of connector contacts by using such analytical techniques as laser mass spectroscopy and gas chromatograph mass spectroscopy to detect failure mode and develop cleaning procedures.
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