Abstract
A compact and thin WiFi SiP module using IPD (Integrated Passive Device) technology is proposed. The WiFi SiP module integrates WiFi single chip, RF front end, EEPROM, and IPD chip as a full system module that can be easily used for 802.11b/g WLAN application, especially in handheld devices. The IPD chip is designed on a silicon substrate to embed passive components required for the WiFi chip and to be a chip carrier for the active ICs integrated in the module. The IPD is fabricated on a silicon substrate using thin film process to build up low cost, high accuracy, and high quality passive elements of resistors, capacitors, and inductors. Two types of SiP approaches to implementing the WiFi modules are presented. Their dimensions are 8.5 x 8.5 x 1.3 mm3 and 5.7 x 9 x 0.925 mm3, respectively. At 2.4 GHz and modulation of 54 Mbps data rate, the WiFi module can provide linear output power up to 13 dBm and its receiving sensitivity is -72 dBm.
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