A Compact RF Front-End SiP Using Silicon-Based Integrated Passive Devices

Abstract

This paper presents a compact RF front-end SiP (System in Package) using silicon-based integrated passive device (IPD). Several IPDs and active chips are integrated in the SiP as a full system module. The IPDs are designed on the silicon substrate and as a chip carrier for the active chips. The active chips are assembled on the substrate by using the flip-chip technology. SiP packaging type is the ball gird array (BGA) and the dimension is $\pmb{14. 5}\mathbf{x}\pmb{6.8}\mathbf{x}\pmb{0.8}\mathbf{mm}\pmb{3}$ that is much smaller than using traditional integration technique. The results satisfy our design that concluding the silicon-based IPD technology is a good choice for RF module and can be easily used for transmitter&receiver applications.