Abstract
A compact WiFi SiP module using IPD (Integrated Passive Device) Rx Balun is proposed. This WiFi SiP module integrates active chip, RF front end circuit, EEPROM and IPD chip as a full system module that can be easily used for 802.11g WLAN application, especially in handheld products like note book or cell phone. The IPD Rx Balun is designed on a silicon substrate, and soldered on substrate with WiFi chip. The IPD Rx Balun is fabricated on a silicon substrate using thin film process to build up low cost, high performance, and high quality passive component of capacitors, and inductors. Two designs of IPD Rx Balun to meet the WiFi module requirement are presented. Their dimensions are all 1.0×0.895×0.5 mm3 (LxWxH). The simulation results show that the baluns achieves 1.0 dB insertion loss and -15 dB return loss between the 2.4-2.5 GHz operation bandwidth. The phase and amplitude imbalances are less than 10° and 2 dB, respectively. Eventually, this SiP module receiving sensitivity is about -73 dBm at 54Mbps data rate, and meet 802.11g spec.
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