Microstructure, mechanical properties and hermeticity of W-Cu/HTCC brazed joints with surface metallization

Abstract

WCu alloy and high temperature co-fired ceramic (HTCC) were metallized through electroless nickel plating, then one series of W-Cu/Ni/AgCu/Ni/HTCC joints were successfully brazed with AgCu filler. The microstructure, mechanical properties, and hermeticity of W-Cu/HTCC joints were systematically investigated, and the fracture paths of the joints were summarized. The results revealed that the interface microstructure of the joints consisted of Ni(Cu)-W, Ni3P, CuNi, Cu(s,s), and Ag(s,s) phases. As the brazing temperature increased, Ni atoms gradually diffused from the NiP layer into the filler layer and substrate. At 900 °C, the NiP layer dissolved, and Cu atoms from the WCu alloy diffused into the solder layer, leading to a sharp growth in joint thickness. The shear tests indicated that the promotion of Cu content in the filler layer effectively alleviated the residual stress in the joints, resulting in higher joint strength. The maximum shear strength of 73.57 MPa was reached when the joints brazed at 840 °C. The hermeticity measurement results showed that the joints brazed at 900 °C for 10 min exhibited exceptional hermeticity, with a helium leakage rate of 2.51 × 10−11 Pa·m3/s. This work provided a reference for the connection of metal packaging materials with high temperature co-fired ceramics.