Abstract
Multilayer packages represent a traditional application of Low Temperature Co-fired Ceramics (LTCC) in electronics. Nowadays, the use of the LTCC is becoming very popular in construction of microstrip filters applied in GHz (HF) range. Research and development on the LTCC microstrip filters performed at Technical University of Kosice has revealed yet unexplored possibility of using various LTCC up to 13 GHz and in this way a possibility of microelectronic structure production applied in the communication application. In this study, we will find out a method of shrinkage instability elimination as well as a correlation between shrinkage and mechanical properties. Dimensional accuracy and flatness of the ceramic substrate is the most important factor in the development of the microstrip filters applied in the HF area. The paper reviews LTCC processes from this point of view and shows that the main aspect of LTCC technology is targeting a more precise manufacturing tolerance control in which electrical performance (scattering parameters) is sensitive to the HF area such as realization of fine line microstrip structure.
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