Microstructure and Mechanical Properties of Pressureless Sintered Silver Die-attach Materials

Abstract

Abstract Microstructural and mechanical properties of a pressureless sintered silver material were measured. The Microstructure of the pressureless sintered silver material had pores of less than 1 μm in size and some silver matrices sintered with nanoparticles between each other. The pressureless sintered silver material could be bonded on bare copper without applying an external pressure. After subjecting the material to a high temperature exposure test at 250 °C and for 1000 h, it showed no substantial change in microstructure and showed a constant Young's modulus of 14 GPa. The pressureless sintered silver material in this work did not show any embrittlement or increase in pore size after the high temperature exposure test, which demonstrated that the material has reliable physical and mechanical properties at temperatures up to 250 °C.