Abstract
Most of the MEMS relays reported in the field now are based on silicon fabrication and cannot be used for power applications. In this paper, we report a research effort to microfabricate an electromagnetic relay for power applications using a multilayer UV-LIGA process. A mechanically wrapped coil was used and very simple design for the magnetic circuit was adopted to increase the design flexibility and performances. The broad material selection and the capability of making high aspect ratio microstructures of the UV-LIGA make the technology best suited for fabricating microelectromechanical relays for power applications. The prototype relay has a truly three-dimensional structure and very suitable for large power capacity applications.
Published Version
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