Abstract
The present work investigated the microbial-induced pitting behavior of the 70/30 copper-nickel (Cu-Ni) alloy. Unlike the MIC of Cu by Desulfovibrio vulgaris, the alloy exhibited considerable pitting sensitivity and pit nucleation frequency under the 10%, 50%, and 100% carbon source (CS) levels. The metastable pit was more likely to evolve into stable growth in the full-strength medium. Meanwhile, a model was established to explain the alloy pitting mechanism induced by D. vulgaris. New evidence further verified that Cu-Ni alloy MIC was not only ascribed to the biogenic H2S but the electroactive D. vulgaris biofilms via extracellular electron transfer (EET) for energy harvest.
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