Abstract
The micro-structure transformation of silicon (MSTS), which is a transformation technology for patterning silicon surfaces by hydrogen annealing, is presented for the first time. The transformation was controlled by the parameters of annealing pressure as well as annealing time and temperature. Voids of sub-micrometer regime size can be intentionally formed in the silicon substrates by making use of transformation. Electrical characteristics, such as the reliability of the thin dielectrics formed in the deep trenches, were improved with the aid of the MSTS process, due to the flattening of the inside surface of the trenches and the rounding of the corners. The mechanism of the transformation by MSTS was studied by means of molecular dynamics, which clearly shows the migration of silicon atoms on the surface. MSTS is a promising technology for the fabrication of future integrated circuits in silicon.
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