Abstract
Abstract In the era of AI, 5G, big data, and autonomous driving, those applications all require a high bandwidth low latency data computing. Traditional electronic packaging structures are classified into many levels and each level are connected by solders or cables. These many levels of structures cause system performance degradation. Hence structure solutions of 2.5D, 2.1D, 2.3D and 2.0D with multi-chip packaging are needed for high performance computing system. Currently 2.5D is the HPC standard structure, however the cost and size limitation of 2.5D drive users to seek alternative solutions. The structure of 2.0D, 2.1D and 2.3D offer less solder and TXVs are emerging as contenders to fill the requirement of large substrate size and fine line requirements in the future. Among them 2.0D structure shows great potential. Three 2.0D test vehicles have been built to evaluate fine pitch assembly, reliability and structure enhancement. The results show 2.0D structure has great potential to be a HPC solution of the near future.
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