Abstract
Interest in die-attach materials with high thermostability has been stimulated by the high junction temperature of power semiconductors. Sintered Ag nanoparticle bonding is the most attractive candidate for use as solder because of its high melting point (1253 K) and low process temperature (~573 K). Recent studies have assumed that this bonding exhibits high thermostability above 573 K. However, in fact, it is difficult to preserve the bonding strength after high-temperature storage at 523 K for 1000 h. Thus, we first clarified that the sintered Ag nanoparticle bonding was degraded by micropore coalescence caused by the Ag grain growth. We then developed the metal salt solution-nanoprecipitation (MS2NP) method for improving the reliability of the sintered Ag nanoparticle bonding. We found that the bonding used by the MS2NP method can maintain a high die-shear strength (~40 MPa) even after high-temperature storage at 573 K for 1000 h.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
