Abstract
This article details the design of an electronically scanning phased array antenna with proposed fabrication process steps. Structure is based upon RF micro-electromechanical system (MEMS) technology. Capacitive type shunt switches have been implemented here to cater high frequency operation. The architecture, which is deigned at 30 GHz, consists of 3-bit (11.25º, 22.5º and 45º) integrated Switched-line phase shifter and a linearly polarized microstrip patch antenna. Detailed design tricks of the Ka-band phase shifter is outlined here. The whole design is targeted for future monolithic integration. So, the substrate of choice is High Resistive Silicon (ρ > 8kΩ-cm, tan δ =0.01 and ϵr =11.8). The overall circuit occupies an cross-sectional area of 20 × 5 mm2. The simulated results show that the phase shifter can provide nearly 11.25º/22.5º/45º phase shifts and their combinations at the expense of 1dB average insertion loss at 30 GHz for eight combinations. Practical fabrication process flow using surface micromachining is proposed here. Critical dimensions of the phased array structure is governed by the deign rules of the standard CMOS/MEMS foundry.
Highlights
People have witnessed the tremendous potential of Micro Electro Mechanical Systems (MEMS) technology in almost every aspect of engineering field
Bulky devices or circuit elements of now-a-days are on the verge of replacement with MEMS devices because of its tiny size, light weight, low insertion loss, negligible power loss and above all linear characteristics [1,2,3]
There is a need to realize all system components on the same platform of a single substrate, forming a monolithic version of phased array, which is possible with the enabling MEMS technology
Summary
People have witnessed the tremendous potential of Micro Electro Mechanical Systems (MEMS) technology in almost every aspect of engineering field. Till date, antenna elements, phase shifter component and feed network are designed and manufactured separately on different substrates and integrated with hybrid connections. It increases the circuit size and packaging costs and invites parasitic effects and extra losses associated at higher frequencies[6][7]. To alleviate these issues, there is a need to realize all system components on the same platform of a single substrate, forming a monolithic version of phased array, which is possible with the enabling MEMS technology.
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