Abstract
We demonstrate memristive functions of the room temperature thermoelectric material Bi-Se fabricated by electrochemical deposition in combination with active electrode Ag-based contacts. We present microfabrication steps for creating polymer molds for the growth of compact memristive films. The electrical measurements show clear forming-free resistive switching behaviour for the electrochemically deposited material while temperature dependent measurements point to Schottky and space-charge-limited-current conduction mechanisms. For the envisioned combination of the memristors with a thermoelectric device we can conclude that electrodeposition is a viable method to produce silver-chalcogenide based non-volatile memristors for co-integration in zero power sensors.
Highlights
The growing trends of miniaturization, reduction of power consumption and increased portability of IoT devices call for integration of components, using the same materials to perform multiple functions
We demonstrate memristive functions of the room temperature thermoelectric material Bi-Se fabricated by electrochemical deposition in combination with active electrode Ag-based contacts
We demonstrate that the room temperature thermoelectric material bismuth selenide exhibits memristive properties that can be used for functional co-integration in hybrid ‘zeropower’ sensors for autonomous applications
Summary
The growing trends of miniaturization, reduction of power consumption and increased portability of IoT devices call for integration of components, using the same materials to perform multiple functions. We propose electrodeposition (ECD) as a versatile additive manufacturing technology for the fabrication of functional devices on polymeric substrates and for the cointegration of thermoelectric based heat flux sensors with a non-volatile resistive switching memory to sense and log critical values of temperature differences or heat flux. We select BixSey and ECD for the memristor because it allows co-integration of thermoelectric based heat flux sensors and accommodate the design requirements to maintain a sufficiently high temperature difference across the thermoelectric device. ECD is commonly used to fabricate thermoelectric harvesters and sensors [20] and offers the advantage of filling small holes as well as covering larger device areas It is a low cost, facile and scalable method that enables control over crystallinity, composition, doping and thickness by adjusting the process parameters [21, 22]. The constraints by the envisioned co-integration are applied and evaluated for use in combined systems
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