Abstract
An investigation was conducted to examine the mechanical strength and tribological properties of boron nitride (BN) films ion-beam-deposited on silicon, fused silica (SiO2), gallium arsenide (GaAs) and indium phosphide (InP) substrates in sliding contact with a diamond pin under a load. The results of the investigation indicate that BN films on non-metallic substrates, like metal films on metallic substrates, deform elastically and plastically in the interfacial region when in contact with a diamond pin. However, unlike metal films and substrates, BN films on non-metallic substrates can fracture when they are critically loaded. Not only does the yield pressure (hardness) of silicon and SiO2 substrates increase by a factor of two in the presence of a BN film, but the critical load needed to fracture also increases. The presence of films on the brittle substrates can arrest crack formation. The BN film reduces adhesion and friction in the sliding contact. BN adheres to silicon and SiO2 and forms a good quality film, but it adheres poorly to GaAs and InP.
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