Abstract
As the first stage in a series of experiments to assess the mechanical properties of single crystal Cu-Ni composite films, the mechanical behavior of vacuum-deposited polycrystal and single crystal Cu films in the thickness range from 3000 to 20,000 Å have been determined. As-deposited polycrystalline films were found to have a high breaking stress of 55 kg/mm 2. Contrary to some observations reported in the literature, the breaking stress did not depend on thickness over the thickness range tested. Single crystal films exhibited much lower breaking stress (18 kg/mm 2) and smaller plastic strain at fracture than polycrystalline films. Creep at room temperature was observed for all films as has been reported previously. Electron microscopy and electron diffraction investigations of the films are reported.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call