Abstract
In order to better interpret the results from a strain gage investigation of the effects of stress induced by polystyrene bead foam (PSBF) on electronic devices, the tensile and compressive properties of 0.2 g/cm/sup 3/ potting PSBF needed to be determined. These data are also required for mathematical models being employed to predict the force PSBF may exert on components. The properties were determined to be a function of temperature and residual pentane (blowing agent) content at -54/sup 0/, 25/sup 0/, and 74/sup 0/C. Both as-molded pentane content (1.4%) and heat-aged pentane content (less than 0.2%) were evaluated. Five specimens were tested at each condition. The material evaluated was BF-61 expandable polystyrene bead obtained from the BASF Corporation and molded to simulate the foam used for potting electronic components.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
