Abstract
This experimental stress analysis evaluates polystyrene bead foam (PSBF) as an encapsulant. Direct comparison data are included for polyurethane foam encapsulation. Thermal stresses on solder joints using a thumb tack test are compared for these foam encapsulants and GMB/epoxy. Special transducer designs are used to measure thermomechanical stresses and deflections. Failure criteria for some of the electronic components involved are delineated. The mechanical properties of potting polystyrene bead foam is presented and compared with the properties of structural polystyrene bead foam. The thermomechanical load and deflection data and the transducers developed are aids for making stress analysis in other foam encapsulated units. Polystyrene bead foam is concluded to be a safe encapsulant for certain electronic packages, but polyurethane foam is not.
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