Abstract
Abstract The deformation and failure mechanism of a multilayered thin film consisting of alternating soft Cu and hard TiN interlayers has been studied by in situ SEM compression of micro-pillars and finite element simulations. While the yielding of the multilayer is governed by the 'size-dependent' strength of Cu, the failure was found to occur by shearing of the columnar grains of TiN. At elevated temperatures of 200 and 400 °C, the yielding of the multilayers is governed by the stress-assisted diffusion of the Cu interlayers, which coalesce into microcrystals and grow into larger faceted crystals.
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