Abstract
A new method of removing waste chips is proposed by focusing on the key factors affecting the processing quality and efficiency of high energy beams. Firstly, a mathematical model has been established to provide the theoretical basis for the separation of solid–liquid suspension under ultrasonic standing wave. Secondly, the distribution of sound field with and without droplet has been simulated. Thirdly, the deformation and movement of droplets are simulated and tested. It is found that the sound pressure around the droplet is greater than the sound pressure in the droplet, which can promote the separation of droplets and provide theoretical support for the ultrasonic suspension separation of droplet; under the interaction of acoustic radiation force, surface tension, adhesion, and static pressure, the droplet is deformed so that the gas fluid around the droplet is concentrated in the center to achieve droplet separation, and the droplet just as a flat ball with a central sag is stably suspended in the acoustic wave node.
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