Manufacturing Readiness of BVA™ Technology for Fine-Pitch Package-on-Package

Abstract

Ever increasing performance demands in a rapidly evolving smart phone market have led to a need for higher density interconnections linking memory components with logic devices in a standard package on package (PoP) configuration. While existing solutions present a technological roadblock at 350–400μm PoP pitch, new Bond Via Array (BVA™) technology provides a cost effective and scalable alternative that can achieve 240μm and below pitch values while utilizing conventional wirebond package assembly processes and tools. BVA is a high density, ultra-fine pitch package-on-package (PoP) interconnect solution that enables more than 1000 high aspect ratio connections between memory and processor components in a standard outline PoP. This increase significantly improves PoP capability and correspondingly provides increased bandwidth for the next generation of mobile devices. Here we discuss the 1020 IO BVA demonstration test vehicle, associated manufacturing process details, reliability performance and bi-level socket hardware developed to test these wire bond based novel interconnects. Furthermore the overall high volume manufacturing (HVM) readiness state of this technology for PoP applications will be described. The 1020 IO BVA prototype features 5 rows of vertical interconnects at 0.24mm pitch within an industry standard 14 x14mm package footprint. Although BVA interconnects were primarily developed for PoP packages, they offer many benefits over traditional vertical interconnects and can be implemented in a variety of other applications.