Abstract
Composite electroforming is an electroplating technique basically. The ceramic or other type powder is mixed into electroforming solution, then codeposited with metal ion by using electroplating method. The codeposit is strengthen by the ceramic powder, which can be used for the application in MEMS field. We do the microcomposite electroforming research by using ultrafine (submicron or nano-sized) powder. The 20g/L silicon carbide powder added to nickel sulfamate electroforming solution can obtain the higher hardness and internal stress deposits (1.5 wt% SiC). Because high internal stress is harmful for electroforming process, it's necessary to take a suitable electrolyte and controlled condition for high hardness and low internal stress in microcomposite electroforming process.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
