LTCC package for high-bandwidth logic to memory interconnection

Abstract

Advancements in packaging technologies are required to meet the future bandwidth, and space- and energy- efficient demands of ICT systems. One of the key technologies is 2.5D packaging using a silicon interposer with through silicon vias (TSVs). However, forming the TSV and thinning the wafer makes the Si interposer's cost high. Furthermore, using an organic substrate causes high electrical losses and warpage. We propose a low-temperature co-fired ceramics (LTCC) package with fine line layers to help alleviate these problems. The surface of the LTCC substrate is made very flat, so fine patterns with line/space that is 2/2μm can be formed. The LTCC package has been expected to decrease the necessary costs by simplifying the assembly process and introducing a panel-based process. Moreover, the LTCC substrate is more reliable than a Si interposer with an organic substrate and can transmit a high data rate signal at a lower loss. We demonstrated the possibility of high Bandwidth Memory (HBM) routing using the LTCC package.