Abstract
Hybrid microelectronics modules fabricated on LTCC (Low Temperature Co-fired Ceramic) substrates are most used in aerospace, automotive and medical industry. Microelectronics modules on LTCC substrates are common application for sensors in ABS or Air Bags systems. High scale of circuit integration and possibility to combine different types of elements and mounting techniques are factor which drags attention of Research Laboratories to develop new generations of hybrid microelectronics modules and new technologies of their fabrication. In the paper new method of fabrication hybrid microelectronic modules on LTCC substrates using Inkjet printing technique is describe. In particular latest achievements of Inkjet printed high resolutions circuits on unfired LTCC foil were presented. Paper also include unprecedented method of filing VIA (Vertical Electrical Connections) using developed in Tele & Radio Research Institute Inkjet printing System. Problems in fabrication hybrid microelectronic modules on LTCC substrates, in particular with screen printing electrical connections and VIA holes filing were discussed. Advantages of proposed new method of fabrication electric connections using Inkjet printing on LTCC substrates were given and possible areas of application were discussed.
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