Thermal design and analysis of high power LED with LTCC packaging

Abstract

Two enhanced high power LED thermal structures with LTCC (Low Temperature Cofired Ceramics) packaging are presented. At first, these two types of structures are introduced respectively in details. One is called structure GPC (Gold-plated Copper) and the other is called structure SPA (Silver-plated Aluminum). Later, thermal analyses are made by CFD software and the calculated-junction-temperature will be considered an important judgment for these two LEDs thermal performance. Meanwhile, results are compared and there thermal performances are analyzed. At last, a suggestion of high power LED with LTCC packages is presented. This work may provide some basis for High power LED with LTCC packaging on thermal design and analysis.