Abstract

With the extensive use of the wireless communication, the development of modern electronic packaging trends to miniaturization, high integration and low cost. In this paper, we took the advantage of LTCC SIP technology, and combined ADS and CST software to work together to make the integrated packaging of passive components and RF transceiver active system. Based on the LTCC technology, we designed a low noise amplifier system with a gain of 30 dB, and a noise figure below 2.2 dB, which substantially achieved the goal of miniaturization. Meanwhile, the module could be applied in all receivers front-end at a frequency of 2.4 GHz.

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