Low cost MCM package for mobile telecommunication

Abstract

The multilayer ceramic MCM package offers an attractive alternative to the conventional plastic QFP package in terms of significant size reduction, thickness, and performance at high frequencies for the mobile communication market. The package requirements can be realized at a low cost through multichip modulization in multilayer ceramics. The MCM offers significant advantages over system-on-a-chip solutions. System-on-a-chip development takes 4 to 12 months at a cost of about $200000, but in the case of ceramic modulization, development takes 1 to 2 months at a cost of $10000 to $40000. MC2LIP (multichip multilayer ceramic leaded interposer), as an example of a low cost ceramic MCM, can be designed in the standard footprint of a PQFP. Moreover, reduction of substrate cost and system development cycle time improves assembly productivity. In addition, not only can the cost of the initial stages of research and development be reduced, but also the hybrid LCC can be the solution for the package requirements for the MCM market for consumer products, and is particularly suited to handset applications.