Abstract
High power electron beams can be used to machine vias and interconnecting structures in ceramic green-sheets. The advantages of this technology are: direct maskless metallization, noncontact machining of high density via and interconnecting structures of fine dimensions. These features translate themselves into design and development of state of the art multilayer ceramic (MLC) packaging on a quick turn around basis from design to build. Electron beam technology offers accurate machining of three dimensional interconnecting line structures. Vias of aspect ratio > 3 and diameters as small as 30 μm have been fabricated.
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