Research on the Design and Fabrication of Aluminum Nitride Microwave Multilayer Ceramic Package

Abstract

Aluminum nitride ceramic material have excellent electrical and thermal properties. Multilayer ceramic processing technology can carry out high density multilayer wiring. Ceramic insulator structure is an ideal packaging form for packaging higher frequency chips. Ceramic welding ball grid array packaging form has excellent electrical performance, which is one of the mainstream ways of semiconductor integrated circuit chip installation. This paper integrates the RF transmission port structure of high thermal conductivity aluminum nitride multilayer co-fired ceramics and ceramic insulators as well as the package form of ceramic ball array, designs and prepares an aluminum nitride ceramic package that can package multiple chips, and introduces its design and fabrication method. Stress simulation software was used to design the structure of the package, and electromagnetic simulation software was used to simulate and optimize the RF port of the package. The transmission path of radio frequency adopts micro strip line directly through the wall, and the transmission structure of coplanar waveguide - strip line - coplanar waveguide is designed and manufactured together with the ceramic package. The GSG probe was used to test the package sample, and the measured results showed that, in the frequency band of 4GHz~12GHz, the standing wave ratio of the package RF port was: VSWR≤1.30, and the transmission terminal insertion loss ≤0.20dB.