Abstract
Monolithic 3D (M3D) ICs provide a way to achieve high performance and low power designs within the same technology node, thereby bypassing the need for transistor scaling. M3D ICs have multiple 2D tiers sequentially fabricated on top of each other and connected through Monolithic Inter-tier vias (MIVs) which go from the top metal of the bottom die to the top metal of the top die. MIVs go through the dielectric separation between tiers and the active layer of the top die. The traditional APR tools only support place and route optimization in 2D IC designs and thus cannot handle the M3D designs. This paper provides a survey of all the efforts done to implement commercial quality M3D ICs using 2D APR tools and the benefit of M3D ICs over traditional 2D ICs.
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