Four-tier Monolithic 3D ICs

Abstract

Monolithic 3D IC is an emerging technology to continuously satisfy demands for power reduction under challenges posed by traditional device scaling. In this paper, for the first time, we study power benefits of 4-tier monolithic 3D ICs compared with 2-tier monolithic 3D and 2D ICs. We present a tier partitioning methodology that significantly extends the capability of a state-of-the-art flow built for 2-tier monolithic 3D ICs. We develop two complete RTL-to-GDSII design flows to achieve this goal and offer quantitative comparisons. In addition, we study impacts of inter-tier via usage on 2-tier and 4-tier monolithic 3D ICs. Our experiments show that poorly controlled inter-tier via usage results in up to 6.05% degradation in total power savings. Thus, we develop an effective strategy to achieve inter-tier via configurations to optimize power metrics. Experiments show that 4-tier monolithic 3D ICs outperform 2-tier and 2D IC by 15% and 50% in terms of power and 25% and 75% in area under the same performance.