Abstract
In this paper, we present full-chip designs and their power, performance, and area (PPA) metrics using the ASAP7 process design kit (PDK) and library. Reliable cell library is a key element in evaluating new technological options such as monolithic 3D (M3D) ICs. Given an RTL, we conduct synthesis and place/route to obtain commercial-quality 2D and M3D IC designs and compare PPA. The ASAP7 library is highly useful to build high-quality designs that accurately reflect 7nm technology node. In addition, the full front-end and back-end access provided in ASAP7 allows us to see the impact of various device and interconnect parameters at the full-chip level for both 2D and monolithic 3D ICs. This work demonstrates the critical role of an academic PDK and library in enabling high-quality research in disruptive technologies such as M3D integration.
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