Liquid plug characteristics and heat transfer performance of a silicon-based ultra-thin flat heat pipe at different incline angles

Abstract

Silicon-based ultra-thin flat heat pipes (UFHPs) that can be integrated with semiconductor devices provide an opportunity for electronic thermal management. To meet the requirements of various operation states, the impacts of gravity on the liquid plug characteristics and heat transfer performance of an UFHP are investigated by a visualization experiment conducted at different incline angles. Condensate flows back through microgrooves under the capillary pressure and gravity under a low heating power (capillary flow stage), and then excess condensate flows back along the edges of the UFHP under a higher heating power (gravitational flow stage). Over a certain heating power (Q ≥ 14 W), liquid plug fluctuations caused by vapor entrainment are observed with periodic dry-out at the evaporator under large incline angles (α ≥ 60°), corresponding to temperature fluctuations. Intense fluctuations of the liquid plug enhance sensible heat transfer, although the liquid plug occupies the condenser area and impedes the vapor flow. Meanwhile, evaporation at the evaporator benefits from corner-film evaporation until a large area of dry-out occurs. Due to the increased gravity and buoyancy, a larger incline angle is conducive to thermal performance enhancement, but this effect becomes restricted as the heating power rises. At a cooling-water temperature of 20 ℃ and an incline angle of 90°, the lowest thermal resistances of the UFHP yield a value of 1.14 ℃/W at 4 W in the steady stage and a value of 1.22 ℃/W at 18 W in the fluctuation stage, respectively. The heat transfer limit of UFHP with overfilling reaches 24 W, compared with the theoretical heat transfer capacity of 8.9 W at an incline angle of 90°. Additionally, a higher cooling-water temperature is beneficial for the thermal performance in the capillary flow stage, but not in the gravitational flow stage and fluctuation stage. This study provides guidance for the operational design of silicon-based UFHP for electronic thermal management.