Abstract

DC/DC converters to power future CPU cores mandate low-voltage power metal-oxide semiconductor field-effect transistors (MOSFETs) with ultra low on-resistance and gate charge. Conventional vertical trench MOSFETs cannot meet the challenge. In this paper, we introduce an alternative device solution, the large-area lateral power MOSFET with a unique metal interconnect scheme and a chip-scale package. We have designed and fabricated a family of lateral power MOSFETs including a sub-10 V class power MOSFET with a record-low R/sub DS(ON)/ of 1m/spl Omega/ at a gate voltage of 6V, approximately 50% of the lowest R/sub DS(ON)/ previously reported. The new device has a total gate charge Q/sub g/ of 22nC at 4.5V and a performance figures of merit of less than 30m/spl Omega/-nC, a 3/spl times/ improvement over the state of the art trench MOSFETs. This new MOSFET was used in a 100-W dc/dc converter as the synchronous rectifiers to achieve a 3.5-MHz pulse-width modulation switching frequency, 97%-99% efficiency, and a power density of 970W/in/sup 3/. The new lateral MOSEFT technology offers a viable solution for the next-generation, multimegahertz, high-density dc/dc converters for future CPU cores and many other high-performance power management applications.

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