Laser cladding of Ni-based alloy on copper substrate

Abstract

The laser cladding of Ni1015 alloy on Cu substrate was prepared by a high power continuous wave CO 2 laser. Its microstructure was analyzed by optical microscope (OM), scanning electron microscope (SEM), and X-Ray diffraction (XRD). The average microhardness of the cladding coating was Hv 280, which was almost three times of that of the Cu substrate (Hv 85). OM and SEM observations showed that the obtained coating had a smooth and uniform surface, as well as a metallurgical combination with the Cu substrate without cracks and pores at the interface. With the addition of copper into the nickel-based alloy, the differences of thermal expansion coefficient and melting point between the interlayer and cladding were reduced, which resulted in low stresses during rapid cooling. Moreover, large amount of (Cu, Ni) solid solution formed a metallurgical bonding between the cladding coating and the substrate, which also relaxed the stresses, leading to the reduction of interfacial cracks and pores after laser cladding.